Kohesi Bond TUF 1820 HTS是一种增韧,单组分,银导电环氧系统,不需要混合,并在室温下提供无限的工作寿命。首先,该产品提供非凡的电导率和导热性。它在120°C下仅仅固化60 - 80分钟,在更高的温度下甚至更快。TUF 1820 HTS提供非常宽的服务温度范围4K(-269.15°C)到+200°C。该产品可以承受严重的热循环和冲击,即使在低温。作为一个单组分系统,它提供了易于应用,也附着在广泛的基材,包括金属,陶瓷,复合材料,大多数塑料和玻璃。它提供了优越的粘接和物理强度性能以及出色的尺寸稳定性。TUF 1820 HTS是100%固体和反应系统,即不含任何溶剂或稀释剂。它是银灰色的。它还扩展了一流的耐各种酸,碱,燃料和水的化学性能。 Owing to its dazzling performance, capability of passing NASA low outgassing test and ease of use, TUF 1820 HTS is widely used in demanding electronics, optoelectronic, aerospace, specialty OEM and various vacuum based applications. Product Highlights Silver filled electrically conductive Cryogenically serviceable Superb mechanical strength properties First-rate peel strength Capable of passing NASA low outgassing Unlimited working life at room temperature