HSK夹头卡盘UltraJet 3.0.

BT. 铣削 cutting

新的UltraJet™3.0 Power Chuck是Jetsleeve™2.0的创新组合，这些组合于多年的市场上成立，DieBoldꞌsultragrip™3.0电力卡盘。使用新颖的UltraJet™3.0时，几乎不可能超越重型加工中的芯片，导致更高的切削值和显着更长的工具寿命。省钱。冷却剂供应在高压下通过UltraJet™3.0插座引导，并通过巧妙的喷嘴组件进料到切削工具。文丘里效应使混合物与工具切削刃的速度无关。这确保了最佳的冷却，并有效地在毫秒内脱离所得到的芯片。该功能与空气的干加工一样。因此促进了深孔和空腔的处理。不需要内部冷却的工具。因此，使用具有更稳定的切削刃的更便宜的工具。 In summary, this leads to higher process reliability (unmanned work is possible), a longer cutter life, better surface quality, lower tool costs, higher chip removal rates and significantly reduced quantities of cooling lubricant and compressed air. The maximum clamping forces, the design-related vibration damping properties together with the high Diebold concentricity guarantee maximum chip removal performance in HPC milling with large cutting depths combined with high feed rates and extreme cutting forces. Adapters SK40/SK50 BT40 – BT50 D-BT40 – D-BT50 HSK63 – HSK100 UltraJet™ 3.0 Power Chucks UltraJet™ 3.0 HSK-form-A – DIN 69893-1 fine balanced G2,5 at 25.000 rpmv