采用模块化设计,设备强大的可伸展性。节能,高品质。MAX PCBA维度610x610mm独立软件,操作简便,轻松了解。多种编程方法包括格柏,JPG,文件和CAD等。独特的视觉图形编程,更方便。磁通喷射模块●单喷射或双喷射(可选)。●进口高精度喷射阀,喷嘴直径0.178毫米。●磁通喷射X / Y位置精度≤±0.05mm。●可用于助焊剂喷射的雾化喷涂和滴灌喷射。●通量水平监控。预热模块●顶部热空气和底部红外线预热。 ●For top and bottom preheating, the heating tubes at different area can be opened according to the size of PCBA, different area preheating and temperature controlling. ●Preheating temperature range: 0-200℃, control accuracy: ±2℃. ●Top hot air preheating optional for soldering module, ensure the temperature in soldering process, improve soldering quality. Soldering Module Max wave peak height: 5 mm Max soldering temperature: 350 °C Auto detection of solder level, alarm when solder level drops to setting value. Nozzle connected to base via the magnetic system. Nozzle can be fast replaced. With lighting and camera system, the soldering process can be visual monitored. Adjustable distance of dual pots 79-169mm(for optional).